Mfg Part Number: MMBD7000LT1 | NSN : 5961-01-414-9170 | NIIN : 014149170 |
CAGE Code : 1MQ07 | Manufacturer: Semiconductor Components Industries | Item Name : Semiconductor Devic |
FSC : 5961 Semiconductor Devices and Associated Hardware |
Thank you for your interest in the Semiconductor Devic parts we have in stock on Aviation Integrated. The particular Semiconductor Components Industries item that you require is listed alongside the NSN 5961-01-414-9170 and part number MMBD7000LT1, allowing you to locate it quickly and easily. MMBD7000LT1 is currently in stock and ready for purchase, so we encourage you to take advantage of our Instant RFQ service to acquire a competitive quote for your comparisons. With team members on standby to answer any one of your questions, responses to quote requests or inquiries are completed in just 15 minutes or less.
Take your time to explore our ever-expanding catalogs and you will find that the NSN 5961-01-414-9170 can be found listed under CAGE Code 1MQ07. However, we carry an array of other NSN products like MMBD7000LT1, all of which have been sourced from trusted distributors like Semiconductor Components Industries. Get started with the procurement process by requesting a quote on any product. Please include all of your part requirements and see how Aviation Integrated can serve as your go-to sourcing solution. For additional questions, call or email us directly; we are ready to help you meet your operational deadlines however necessary.
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5961-01-414-9170 Item Description: Semiconductor Devic | 5961 | 014149170 | 0 | N | A | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | A | A | ||||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
Mmbd7000lt1 | 5 | 2 | 3 |
MRC | Criteria | Characteristic |
---|---|---|
ABBH | INCLOSURE MATERIAL | PLASTIC" |
ALAZ | JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | TO-236AB" |
AXGY | MOUNTING METHOD | TERMINAL" |
CTMZ | SEMICONDUCTOR MATERIAL | SILICON" |
CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 100.0 MAXIMUM REVERSE VOLTAGE, INSTANTANEOUS" |
CTQX | CURRENT RATING PER CHARACTERISTIC | 200.00 MILLIAMPERES SOURCE CUTOFF CURRENT PRESET AND 500.00 MILLIAMPERES FORWARD CURRENT, AVERAGE PRESET" |
CTRD | POWER RATING PER CHARACTERISTIC | 225.0 MILLIWATTS SMALL-SIGNAL INPUT POWER, COMMON-COLLECTOR PRESET" |
TTQY | TERMINAL TYPE AND QUANTITY | 3 BONDING PAD" |
ABBH | INCLOSURE MATERIAL | PLASTIC" |
ALAZ | JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | TO-236AB" |
AXGY | MOUNTING METHOD | TERMINAL" |
CTMZ | SEMICONDUCTOR MATERIAL | SILICON" |
CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 100.0 MAXIMUM REVERSE VOLTAGE, INSTANTANEOUS" |
CTQX | CURRENT RATING PER CHARACTERISTIC | 200.00 MILLIAMPERES SOURCE CUTOFF CURRENT PRESET AND 500.00 MILLIAMPERES FORWARD CURRENT, AVERAGE PRESET" |
CTRD | POWER RATING PER CHARACTERISTIC | 225.0 MILLIWATTS SMALL-SIGNAL INPUT POWER, COMMON-COLLECTOR PRESET" |
TTQY | TERMINAL TYPE AND QUANTITY | 3 BONDING PAD" |
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